Quality AI is only as Good as Your Data – “Capturing Good Quality for Good Outcomes”
Know the Data – Capture the Data – Use the Data

The push to increase manufacturing operations with the incorporation of AI continues to surge. To ensure usable, accurate outcomes, an assessment of current operations is needed to establish an AI dataset that will serve as the baseline for analyzing and interpreting the process. A system needs to be established to report process improvements and corrective actions based on the baseline dataset. The quality plan can now be implemented using the baseline data, with enhancements to improve efficiency and reduce costs. Join our panel discussion and learn about the critical data needed to establish the Quality Process, establish the Quality Documentation & Compliance System to support the process, and to provide the Quality Manager, Production Manager, or Operations Manager with quality data to implement the Quality Process, Documentation & Compliance.

The takeaways will be to:
1.    Know the Data with Shop floor planning
2.    Capture the Data with Quality Plans & Compliance
3.    Use the Data to Isolate the defects, establish Sort & Inspection Criteria, & Implement Rapid Deployment with real-time reporting to ensure Good Quality Outcomes!

Controlling ionic contamination is a long‑established element of electronic assembly reliability. In automotive electronics manufacturing, ROSE (Resistivity of Solvent Extract) testing is widely applied and generally regarded as sufficient once a manufacturing process has been qualified based on electrical testing under conditions of damp heat. At the same time, ionic chromatography (IC) provides far greater analytical resolution, prompting discussion about potential benefits and drawbacks.

Building on a recent technical session at AEPC 2026, this panel examines the role, limitations, and appropriate use of IC analysis in ECU manufacturing.

Join the Global Electronics Association for an informative webinar on the European Defence Industrial Programme (EDIP) and upcoming funding opportunities for electronics companies.

Why do electronics fail EMC testing, usually radiated emissions, when they don't have any antennas on board--or at least no antennas for below 500 MHz?

This interactive, virtual event will explain the main ways that cables and boards can act like antennas even though they're not designed to radiate. We'll discuss the two main radiating mechanisms and how they manifest in electronics hardware. Cables and split planes will get the most attention. We'll also include a live hardware demo that shows how these interactions play out in real life.

Scope 3 Category 1 emissions from purchased goods and services often represent the largest share of emissions in the electronics industry, yet they remain among the most complex to measure and manage.
In this webinar, the Global Electronics Association and the Responsible Business Alliance will introduce new industry guidance designed to help companies strengthen Scope 3 Category 1 accounting and accelerate supplier engagement and decarbonization efforts.

Building on the themes from my recent Community Magazine article, “Unlocking Workforce Potential: Beyond Federal Dollars,” this webinar will unpack how employers across the U.S. can access a range of underutilized funding opportunities to support training and apprenticeship programs. We’ll explore how national, state, and private resources can be braided to offset costs, expand training capacity, and build sustainable talent pipelines.

While we’ll highlight recent examples—like the newly awarded Employment Training Panel (ETP) contract that supports California employers—our focus will be national, offering employers a practical roadmap for identifying, combining, and leveraging diverse funding sources to maximize workforce development impact.

This is a must‑attend online event for Training Managers, Learning & Development Directors, HR Managers, Workforce Development Coordinators, Grants Managers, and Administrators.

This webinar explains how to use visual inspection alongside a plug-in thermal camera to detect circuit board faults. By spotting heat anomalies, engineers can quickly locate overheating components, shorts, or other issues that may not be visible — streamlining diagnostics and improving repair accuracy.

This webinar, co-hosted by the Global Electronics Association and Anthesis Group, will offer an update on the current state-of-play on emerging circularity policies for electronics to interested stakeholders, from an advocacy, compliance, and standards development perspective.

Turning Supply Chain Security into Business Value: Only Non-IT Personnel Must Achieve It. IPC-1792 Implementation Guide

Join us for a practical, business-first approach to supply chain security. This webinar explores how involving non-IT stakeholders early in the process leads to smarter investments, fewer missteps, and clearer requirements for IT and security teams.

Wire bonding remains the dominant chip-interconnection method—and it's not going anywhere soon. This webinar offers a practical overview of modern wire bonding processes, metrology challenges, and emerging materials. Learn about pitch shrinkage demands, direct bonding to Cu on ULK substrates, and innovations like silver and gold-coated palladium copper wires. Explore key bonding techniques including thermosonic, ultrasonic, and thermocompression, plus new options for Cu wire coatings.

Perfect for engineers navigating next-gen packaging and reliability.